Reliability & Quality Assurance

The Reliability & Quality Assurance of the devices / boards / sub-systems / systems manufactured at SCL is maintained throughout design, chip fabrication, assembly / packaging and testing phases. Regular inline QA inspection / audits are carried out to ensure defect free manufacturing. Screening and qualification of products for required applications is an integral part of the process. The reliabilty and quality assurance requirements are guided by global performance specifications as per MIL-PRF-38534, MIL-PRF-38535, JEDEC, MIL-883 and other relevant standards. Continuous improvements in processes are implemented through feedbacks at appropriate stages and performing failure analysis.

Reliability & Quality Group At SCL
Facility for Environmental Test
  • Process Reliability Test System.
  • Thermal Shock Chamber (Air to Air).
  • Thermal Shock Chamber (Liquid-to-Liquid).
  • Vibration Test System.
  • High Temperature, High Humidity Chamber.
  • Fine & Gross Leak Test Systems for Hermeticity Check.
  • Life Operating Test Systems (Burn-In Chambers).
  • Constant Acceleration Test System.
  • Mechanical Shock Tester.
  • Particle Impact Noise Detection (PIND) Tester.
  • Electro Static Discharge(ESD) Simulator based on Human Body Model (HBM).
Facility for Environmental Test
  • Scanning Electron Microscope (SEM).
  • Focused Ion Beam System (FIB).
  • Energy Dispersive X-Ray Spectrometer (EDX).
  • Micro Cleaver.
  • Polisher Grinder.
  • Optical Microscopes.
Key Capabilities
  • Screening & Qualification of VLSI devices / ASICs / MEMS devices / boards / sub-systems / systems.
  • Process Qualification.
  • Device Failure Analysis.
  • Process Audits.
  • Quality System & Documentation Control.