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180 nanometer CMOS Process for Fabrication of products in Digital, Mixed Signal and Analog domains |
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Process Equipment Line, In-line Inspection & Metrology Tools and Support Utilities as per international standards |
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Clean Rooms of Class 1, 10, 100 and 1000 with controlled environmental conditions |
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Dedicated bays for Wafer Fabrication Processes viz. Diffusion, Lithography, Etching (Dry & Wet), Implantation, Thin Films working seamlessly from Wafer-in to Wafer-out |
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BKMs (Best Known Methods) comprising regular Tool QCs, Preventive Maintenance and Process Control & Monitoring through in-line defect inspection & measurement through Metrology Tools as per industry standards |
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Commensurate with the requirements of Fab Line, support infrastructure namely High Purity Systems, Utility Plants and Distribution Network operate on 24x7 basis |
Implant Area
Thin Film Area