Assembly & Packaging


           Assembly & Packaging Facility

VLSI & MEMS Packaging facility operating in Class 100 and Class 10000 Clean Rooms includes Die Bonders, Ball & Wedge Wire Bonders, Multi-Zone Furnaces for Hermetic Sealing, Multi-Function Bond Pull Testers, Laser Welder, Dicing Saw, Tape Mounter etc.

 

 

Key Capabilities :

Fine Pitch Bonding capability for pad size of 57mx57m and 65m pitch
Capability of developing customised ceramic packages to address signal integrity and reliability issues for ASICs in 180nm Process
Low Temperature Process for packaging large dies
Multi-Chip Packaging Process for ASICs and sensor devices
MIC Packaging