Reliability & Quality Assurance


The Reliability & Quality of the devices / boards / sub-systems / systems manufactured at SCL is maintained throughout design, chip fabrication, assembly / packaging and testing phases. Regular inline QA inspection / audits are carried out to ensure defect free manufacturing. Screening and qualification of  products for required applications is an integral part of the process. The quality and reliability assurance requirements are guided by global performance specifications as per MIL-PRF-38535, JEDEC, MIL-883 and other relevant standards. Continuous improvements in processes are implemented through feedbacks at appropriate stages and performing failure analysis.


Environmental Test Facility


Facility for Environmental Test 

   


Process Reliability Test System

Process Reliability Test System
Thermal Shock Chamber (Air to Air)
Thermal Shock Chamber (Liquid-to-Liquid)
Vibration Test System
High Temperature, High Humidity Chamber
Fine & Gross Leak Test Systems for Hermeticity Check
Life Operating Test Systems (Burn-In Chambers)
Constant Acceleration Test System
Mechanical Shock Tester
Particle Impact Noise Detection (PIND) Tester
Electro Static Discharge(ESD) Simulator based on Human Body Model (HBM)

Facility for Failure Analysis

Scanning Electron Microscope (SEM)  
Focused Ion Beam System (FIB)
Energy Dispersive X-Ray Spectrometer (EDX )
Micro Cleaver
Polisher Grinder
Optical Microscopes


Key Capabilities

Screening & Qualification of VLSI / MEMS devices / boards / sub-systems / systems  
Process Qualification
Device Failure Analysis
Process Audits
Quality Systems & Documentation Control